January 4, 2008
News Release 08-005
Inv. No. 337-TA-630
Contact: Peg O'Laughlin, 202-205-1819
ITC INSTITUTES SECTION 337 INVESTIGATION
ON CERTAIN SEMICONDUCTOR CHIPS WITH MINIMIZED CHIP PACKAGE SIZE
AND PRODUCTS CONTAINING SAME
The U.S. International Trade Commission (ITC) has voted to institute an investigation of certain semiconductor chips with minimized chip package size and products containing same. The products at issue in this investigation include dynamic random access memory (DRAM) chips, DRAM modules, and computer systems incorporating such DRAM chips and/or DRAM modules.
The investigation is based on a complaint filed by Tessera, Inc. of San Jose, CA, on December 7, 2007. Letters supplementing the complaint were filed on December 21 and 28, 2007. The complaint alleges violations of section 337 of the Tariff Act of 1930 in the importation into the United States of certain semiconductor chips with minimized chip package size and products containing same that infringe patents owned by Tessera. The complainant requests that the ITC issue exclusion orders and cease and desist orders.
The ITC has identified the following as respondents in this investigation:
By instituting this investigation (337-TA-630), the ITC has not yet made any decision on the merits of the case. The case will be referred to the Honorable Charles E. Bullock, an ITC administrative law judge, who will schedule and hold an evidentiary hearing. Judge Bullock will make an initial determination as to whether there is a violation of section 337; that initial determination is subject to review by the Commission.
The ITC will make a final determination in the investigation at the earliest practicable time. Within 45 days after institution of the investigation, the ITC will set a target date for completing the investigation. ITC remedial orders in section 337 cases are effective when issued and become final 60 days after issuance unless disapproved for policy reasons by the U.S. Trade Representative within that 60-day period.