May 15, 2007
News Release 07-057
Inv. No. 337-TA-605
Contact: Peg O'Laughlin, 202-205-1819
ITC INSTITUTES SECTION 337 INVESTIGATION
ON CERTAIN SEMICONDUCTOR CHIPS WITH MINIMIZED CHIP PACKAGE SIZE
AND PRODUCTS CONTAINING SAME
The U.S. International Trade Commission (ITC) has voted to institute an investigation of certain semiconductor chips with minimized chip package size and products containing same. The products at issue in this investigation are used in a variety of products, including cellular telephones, computers, and digital cameras.
The investigation is based on a complaint filed by Tessera, Inc., of San Jose, CA, on April 17, 2007. The complaint alleges violations of section 337 of the Tariff Act of 1930 in the importation into the United States of certain semiconductor chips with minimized chip package size and products containing same that infringe patents owned by Tessera. The complainant requests that the ITC issue a permanent exclusion order and a permanent cease and desist order.
The ITC has identified the following as respondents in this investigation:
By instituting this investigation (337-TA-605), the ITC has not yet made any decision on the merits of the case. The case will be referred to the Honorable Robert L. Barton, Jr., an ITC administrative law judge, who will schedule and hold an evidentiary hearing. Judge Barton will make an initial determination as to whether there is a violation of section 337; that initial determination is subject to review by the Commission.
The ITC will make a final determination in the investigation at the earliest practicable time. Within 45 days after institution of the investigation, the ITC will set a target date for completing the investigation. ITC remedial orders in section 337 cases are effective when issued and become final 60 days after issuance unless disapproved for policy reasons by the U.S. Trade Representative within that 60-day period.